Thin film high polymer laminated capacitor

A thin film high polymer laminated capacitor comprising:

• a laminated chip including
• dielectric layers, and
• internal electrode layers including first metal layers including a first metal vapor-deposited on the dielectric layers, and second metal layers including a second metal vapor-deposited on the first metal layers,
• the dielectric layers and the internal electrode layers being laminated and bonded alternately, and
• external electrodes formed on one end and the other end of the laminated chip,
• the laminated chip having a first region having the first metal layers formed on the dielectric layers, which are laminated alternately, and edge regions having the second metal layers formed on layers connected to the one end and layers connected to the other end in the first metal layers, which are laminated alternately,
• the first region having a capacitor function region, and the edge region having a heavy edge,
• the capacitor function region has a constant width in each laminated pair of the first metal layers and the dielectric layers, and
• a distance between the heavy edge on one side and the heavy edge on another side in one layer increases as the alternating lamination progresses.