Wire embedded label on special substrate with or without inductive coupling
OwnerPuneet Kapoor, Alok Kapoorinventors
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Abstract
In accordance with the embodiments of this disclosure, an RFID label or tag (201, 202, 203, 204) is disclosed. The RFID label or tag (201, 202, 203, 204) includes one or more layers of substrate (1), one or more integrated circuits (2), and one or more antennas (3,3A). Herein, the one or more integrated circuits (2) and the one or more antennas (3,3A) are embedded on the one or more layers of substrate (1).
Claims12
A radio frequency identification (RFID) label or tag (201, 202, 203, 204) for an article, comprising:
- one or more layers of substrate (1);
- a single integrated circuit (2);
- and
- a primary antenna (3A) and a secondary antenna (3),
- wherein the primary antenna (3A) is connected to the single integrated circuit (2) and the secondary antenna (3) is inductively coupled to the primary antenna (3A);
- wherein the integrated circuit (2) and the primary and secondary antennas (3, 3A) are embedded on a single layer of substrate (1) among the one or more layers of substrate;
- wherein the secondary antenna (3) is a conductive wire antenna;
- and
- wherein said RFID label or tag is positioned within the article using in-mould labelling process, or an over mould labelling process facilitated by the integrated circuit (2) and the primary and secondary antennas (3, 3A) being located on the single layer of substrate (1).
A method of manufacturing a Radio Frequency Identification (RFID) label or tag (201, 202, 203, 204) for being positioned within an article using in-mould or over mould labelling process, comprising:
- providing one or more layers of substrate (1), a single integrated circuit (2);
- and a primary antenna (3A) connected to the single integrated circuit (2) and a secondary antenna (3) inductively coupled to the primary antenna (3A);
- and
- embedding the primary antenna (3A) and the secondary antenna (3) on a single layer of substrate (1) among the one or more layers of substrate (1) along with the single integrated circuit (2);
- wherein the in-mould labelling or over mould labelling process is facilitated by the integrated circuit (2) and the primary and secondary antennas (3, 3A) being located on the single layer of substrate (1).
Dependencies are inferred from the claim text.