Optics-based distributed unified memory system
AssigneeApple Inc.
InventorsEran Tamari, Brian S. Leibowitz
Life of this patent
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Abstract
Techniques are disclosed relating to computing systems that use silicon photonics. In some embodiments, a computing system includes a plurality of compute die packages that include processors configured to execute program instructions that operate on data stored in a distributed memory accessible via a unified memory architecture. The computing system further includes a plurality of memory die packages configured to implement the unified memory architecture such that a given one of the memory die packages includes one or more optical interfaces configured to receive memory requests from the processors and one or more memory controllers configured to access a portion of the distributed memory in response to the received memory requests.
Claims18
A computing system, comprising:
- a plurality of compute die packages that include processors configured to execute program instructions that operate on data stored in a distributed memory accessible via a unified memory architecture;
- and
- a plurality of memory die packages configured to implement the unified memory architecture, wherein a given one of the memory die packages includes:
- one or more optical dies including one or more optical interfaces configured to receive memory requests from the processors;
- and
- a memory controller die coupled to the one or more optical dies via one or more die-to-die interconnects, wherein the memory controller die includes a cache and one or more memory controllers configured to access a portion of the distributed memory in response to the received memory requests;
- and
- wherein the plurality of compute die packages are distinct from the plurality of memory die packages.
An integrated circuit, comprising:
- a memory die package having one or more co-packaged dies, wherein the memory die package includes:
- one or more optical dies including an optical interface configured to receive, via an optical fiber, memory requests from one or more processors in one or more compute die packages separate from the memory die package;
- a memory controller die coupled to the one or more optical dies via one or more die-to-die interconnects, wherein the memory controller die includes:
- a memory controller coupled to a memory and configured to service the memory requests;
- and
- a cache of the memory configured to store a portion of data stored in the memory.
Dependencies are inferred from the claim text.