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US 12,585,315 B2Granted
Fan enclosure with adjustable side venting
AssigneeIntel Corporation
InventorsXiyong Tian, Chunlin Bai, Baocí George Sun, Li Zhang, Chiu Lun Ronald Cheng
Life of this patent
Estimating the term…
Abstract
Particular embodiments described herein provide for an electronic device that can be configured to include a first heat source, a second heat source, and a fan inside a fan enclosure between the first heat source and the second heat source. The fan enclosure includes a main vent to direct air from the fan towards a heatsink and one or more side vents to direct air from the fan towards the first heat source or the second heat source.
Claims10
An electronic device, comprising:
- a first heat source;
- a second heat source;
- a fan inside a fan enclosure, wherein the fan enclosure includes a main vent configured to direct air from the fan towards a heatsink;
- a plurality of side vents configured to direct air from the fan towards the first heat source or the second heat source;
- a channel disposed within an outer portion of the fan enclosure corresponding to a location of the plurality of side vents;
- and
- a slide mechanism retained within the channel, the slide mechanism including a plurality of windows that selectively align with the plurality of side vents by way of a linear movement of the slide mechanism within the channel to thereby control an amount of air output from the plurality of side vents.
4 more elements
A fan enclosure, comprising:
- a fan disposed between a first heat source and a second heat source, the first and second heat sources being associated with an electronic device;
- a main vent configured to direct air from the fan towards a heatsink;
- a plurality of side vents configured to direct air from the fan towards the first heat source or the second heat source;
- and
- a channel disposed within an outer portion of the fan enclosure corresponding to a location of the plurality of side vents;
- and
- a slide mechanism retained within the channel, the slide mechanism including a plurality of windows that selectively align with the plurality of side vents by way of a linear movement of the slide mechanism within the channel to thereby control an amount of airflow output from the plurality of side vents.
4 more elements
A method comprising:
- creating a board layout for an electronic device;
- testing the board layout to determine a hot spot area of the board layout for cooling during operation of the electronic device;
- adding a fan enclosure with side venting to the board layout;
- and
- adjusting a plurality of side vents of the fan enclosure with side venting to force air onto the hot spot area of the board layout,
- wherein the fan enclosure with side venting comprises:
- a main vent configured to direct air from a fan towards a heatsink and the plurality of side vents;
- a channel disposed within an outer portion of the fan enclosure corresponding to a location of the plurality of side vents;
- and
- a slide mechanism retained within the channel, the slide mechanism including a plurality of windows that selectively align with the plurality of side vents by way of the adjusting the plurality of side vents via a linear movement of the slide mechanism within the channel to control an amount of air output from the plurality of side vents.
7 more elements
Dependencies are inferred from the claim text.