Liquid crystal on silicon display device having stacked integrated circuit substrates

A liquid crystal display device comprising:

• a first circuit substrate including a top surface, an opposite bottom surface, an array of pixel mirrors formed on said top surface, a first set of integrated circuits configured to assert pixel data on said pixel mirrors, and a plurality of electrical contacts formed on said bottom surface, said electrical contacts connected to said first set of integrated circuits;
• a liquid crystal layer disposed over said pixel mirrors;
• a transparent electrode disposed over said liquid crystal layer;
• and
• a second circuit substrate including a top surface, a bottom surface opposite said top surface, a second set of electrical contacts formed on said top surface, and a second set of integrated circuits electrically coupled to said second set of electrical contacts, said second set of integrated circuits including a frame buffer configured to store digital video data and control circuitry configured to generate control signals based at least in part on said digital video data;
• and wherein
• said first set of electrical contacts is rigidly connected to said second set of electrical contacts, thereby providing a mechanical bond between said first circuit substrate and said second circuit substrate, and providing an electrical connection over which said control signals are communicated from said second set of integrated circuits to said first set of integrated circuits.

A method of manufacturing a liquid crystal display device, said method comprising:

• providing a reflective display backplane including an array of pixel mirrors;
• forming vias through said reflective display backplane;
• providing one or more integrated circuit substrates;
• forming vias in said one or more integrated circuit substrates;
• assembling said reflective display backplane and said one or more integrated circuit substrates in a stacked relationship with said reflective display backplane disposed between a cover glass and said one or more integrated circuit substrates;
• electrically connecting circuitry of said reflective display backplane and said one or more integrated circuit substrates by said vias;
• forming a chip-scale-package structure on a bottom one of said integrated circuit substrates;
• and
• assembling liquid crystal display components over said array of pixel mirrors.