Image pickup module, endoscope, and method for manufacturing image pickup module
AssigneeOlympus Medical Systems Corp.
InventorNau Satake
Life of this patent
Estimating the term…
Abstract
An image pickup module includes: an imager including a light receiving surface; and a back surface opposite to the light receiving surface; a wiring board including a first surface, a bottom surface disposed in a recess surrounded by a plurality of walls, a plurality of electronic components configured to mount on the bottom surface; and a cutout communicating a first space between the back surface and the first surface with a second space inside the recess, the cutout being on a first wall of the plurality of walls; and a resin disposed in the first space, the second space and a third space inside of the cutout, in which the resin is continuous without an interface between the first space, the second space, and the third space.
Claims16
An image pickup module comprising:
- an imager including:
- a light receiving surface;
- and
- a back surface opposite to the light receiving surface;
- a wiring board including:
- a first surface;
- a bottom surface disposed in a recess surrounded by a plurality of walls, a plurality of electronic components configured to mount on the bottom surface, and
- a cutout communicating a first space between the back surface and the first surface with a second space inside the recess, the cutout being on a first wall of the plurality of walls;
- and
- a resin disposed in the first space, the second space and a third space inside of the cutout,
- wherein the resin is continuous without an interface between the first space, the second space, and the third space.
A method for manufacturing an image pickup module, the method comprising:
- producing an imager including:
- a light receiving surface;
- a back surface opposite to the light receiving surface, a plurality of external electrodes disposed on the back surface, and
- producing a wiring board including:
- a first surface, a plurality of bonding electrodes being disposed on the first principal surface;
- a bottom surface disposed in a recess surrounded by a plurality of walls, and
- a cutout communicating a space between the back surface and the first surface with an inside the recess, the cutout being on a first wall of the plurality of walls;
- mounting a plurality of electronic components on the bottom surface;
- bonding the plurality of external electrodes and the plurality of bonding electrodes, respectively, using a plurality of bonding agent;
- and
- injecting a liquid resin to continuously fill each of the recess, the cutout and the space between the back surface and the first surface;
- and
- curing the resin in each of the recess, the cutout and the gap.
Dependencies are inferred from the claim text.