Test apparatus for semiconductor package

A test device for a semiconductor package, the test device comprising:

• a lower socket having first conductive parts mounted on a tester configured to provide a test signal and connected to lower terminals, respectively of a lower package to electrically connect the lower package to the tester;
• a pusher including a square container-shaped body part, a protruding part protruded from the center of the body part, a mounting groove provided between an upper side of the protruding part and the body part, and a vacuum passage in which a vacuum pressure of a vacuum generator is transferred, wherein the pusher is configured to receive power from a driving unit to be moveable to approach toward or recede from the lower package;
• an upper socket fastened to a lower surface of the protruding part with the upper package interposed and having a second conductive part having an upper end connected to lower terminals of the upper package and a lower end capable of connecting to upper terminals of the lower package;
• a ring-shaped silicone pad disposed in the mounting groove;
• and
• a floating plate movably coupled to the pusher and movable by elasticity of the silicone pad,
• wherein the floating plate comprises a side wall part enclosing the protruding part and a contact part provided with an open groove in which a lower surface of the upper socket is exposed, and
• a vacuum pressure of the vacuum generator is applied to the open groove through the vacuum passage.