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US 12,584,741 B2Granted
Inertial measurement device and method for manufacturing inertial measurement device
AssigneeSeiko Epson Corporation
InventorsToru Watanabe, Hiroyuki Ogiso
Life of this patent
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Abstract
An inertial measurement device includes: a substrate having a joining area; a cap; a sensor device accommodated in a resin package and disposed in a mounting area on the substrate in an internal space between the substrate and the cap; and a sealing material and a joining material configured to join the cap to the substrate in the joining area of the substrate. The joining material surrounds the mounting area and has a communication hole for communication between the internal space and the outside, and the sealing material closes the communication hole.
Claims8
An inertial measurement device comprising:
- a substrate having a joining area;
- a cap;
- a sensor device accommodated in a resin package and disposed in a mounting area on the substrate in an internal space between the substrate and the cap;
- and
- a sealing material and a joining material configured to join the cap to the substrate in the joining area of the substrate,
- wherein
- the joining material surrounds the mounting area and has a communication hole for communication between the internal space and outside,
- the sealing material closes the communication hole,
- a first land on which the sensor device is mounted is provided in the mounting area,
- a second land corresponding to the joining material is provided in the joining area,
- a third land is provided outside the communication hole, and
- the sealing material is disposed from the second land to the third land.
9 more elements
Dependencies are inferred from the claim text.