Thin film thickness adjustments for three-dimensional interferometric measurements
OwnerNachum Yoav, Yulia Lovsky +1inventors
InventorsNachum Yoav, Yulia Lovsky, Ronen Levy
Life of this patent
Estimating the term…
Abstract
A 3D surface map of a workpiece is determined using an interferometric quantitative phase imaging technique. The workpiece includes a transparent thin film or layers stack. The 3D surface map is corrected based on a thickness and a refractive index of the transparent thin film or layers stack. This technique can be used with an inspection system configured to perform an interferometric quantitative phase imaging.
Claims19
A system comprising:
- a stage configured to hold a workpiece;
- an inspection system configured to perform an interferometric quantitative phase imaging;
- and
- a processor in electronic communication with the inspection system, wherein the processor is configured to:
- determine a 3D surface map that includes height information in a 2D arrangement from a phase map, wherein the workpiece includes a transparent thin film or layers stack near or on a feature, and wherein the phase map is generated from phase imaging data;
- and
- correct at least one value in the height information of the 3D surface map based on a thickness and a complex refractive index of the transparent thin film or layers stack.
A method comprising:
- determining a 3D surface map of a workpiece using an interferometric quantitative phase imaging technique, wherein the workpiece includes a transparent thin film or layers stack near or on a feature, and wherein the 3D surface map includes height information in a 2D arrangement;
- measuring a thickness and a refractive index using a reflectometer;
- and
- correcting, using a processor, at least one value in the height information of the 3D surface map based on the thickness and the refractive index of the transparent thin film or layers stack.
A non-transitory computer-readable storage medium, comprising one or more programs for executing the following steps on one or more computing devices comprising:
- determining a 3D surface map of a workpiece from data generated using an interferometric quantitative phase imaging technique, wherein the workpiece includes a transparent thin film or layers stack near or on a feature, and wherein the 3D surface map includes height information in a 2D arrangement;
- correcting at least one value in the height information of the 3D surface map based on a thickness and a refractive index of the transparent thin film or layers stack.
Dependencies are inferred from the claim text.