Methods for thermal treatment of substrates
AssigneeAixtron SE
InventorPeter Sebald Lauffer
Life of this patent
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Abstract
In the thermal treatment of substrates, a susceptor is used to hold at least one substrate. The susceptor can be heated with a heater and driven in rotation about a rotation axis by a rotary drive. Means are provided to influence the heat transfer to or from the susceptor in a locally limited manner, synchronized with the rotary movement of the susceptor, to equalize local temperature differences on the rotating susceptor. In particular, a temperature control gas with changing heat conduction properties is periodically fed in a pulsed manner through a feed opening into a gap between the susceptor and a cooling unit.
Claims12
A method for a thermal treatment of substrates, the method comprising:
- heating, by a heater (13) disposed in a housing (1), a susceptor (5) that supports a substrate holder (7);
- and
- rotating the susceptor (5) about a first axis of rotation (A) with respect to the housing (1), wherein a heat transfer from the susceptor (5) to a cooling unit (30) is influenced by altering heat conduction properties of a medium in a thermal influence zone (17) arranged between the susceptor (5) and the cooling unit (30) in a pulsed manner synchronized with the rotation of the susceptor (5), wherein the thermal influence zone (17) is fixed in location with respect to the housing (1).
A method for a thermal treatment of substrates, the method comprising:
- rotating a susceptor (5) about a first axis of rotation (A) with respect to a housing (1), wherein the susceptor (5) supports at least one substrate holder (7) arranged eccentrically with respect to the first axis of rotation (A);
- rotating the substrate holder (7) about a second axis of rotation (B), wherein the substrate holder (7) supports at least one substrate;
- and
- influencing a heat transfer from the susceptor (5) to a cooling unit (30) arranged below the susceptor (5) by altering a thermal conductivity of a medium in a thermal influence zone (17) in a pulsed manner synchronized with the rotation of the susceptor (5),
- wherein with respect to the first axis of rotation (A), the thermal influence zone (17) is disposed radially inwards from, or outwards from, or on, an orbital path of the second axis of rotation (B) about the first axis of rotation (A),
- wherein the medium is arranged between the susceptor (5) and the cooling unit (30) arranged below the susceptor (5), and
- wherein the thermal influence zone (17) is fixed in location with respect to the housing (1).
Dependencies are inferred from the claim text.