Plate assemblies, process kits, and processing chambers for semiconductor manufacturing
AssigneeApplied Materials, Inc.
InventorsAla Moradian, Manjunath Subbanna
Life of this patent
Estimating the term…
Abstract
Embodiments of the present disclosure relate to plate assemblies, process kits, processing chambers, and related components and methods for semiconductor manufacturing. In one implementation, a plate assembly for disposition in a processing chamber includes an inner section that includes an opaque material. The inner section has an outer diameter. The plate assembly includes a first outer section that is arcuate in shape and includes the opaque material. The first outer section includes a first inner shoulder, and a first inner lip extending inwardly relative to the first inner shoulder.
Claims20
A plate assembly for disposition in a processing chamber, comprising:
- an inner section comprising an opaque material, the inner section having an outer diameter;
- a first outer section that is arcuate in shape and comprises the opaque material, the first outer section comprising:
- a first inner shoulder, and
- a first inner lip extending inwardly relative to the first inner shoulder;
- and
- one or more spacers sized and shaped for disposition between the inner section and the first outer section, the one or more spacers comprising a transparent material.
A process kit for disposition in a processing chamber, comprising:
- a liner comprising an inner surface, the inner surface having an inner liner diameter;
- and
- a plate assembly, comprising:
- an inner section having an outer diameter that is lesser than the inner liner diameter, and
- one or more outer sections that are arcuate in shape, the one or more outer sections comprising an outermost section sized and shaped to interface with the liner, the inner section comprising a transparent material or an opaque material, and at least one of the one or more outer sections comprising the other of the transparent material or the opaque material.
A processing chamber applicable for use in semiconductor manufacturing, comprising:
- a chamber body comprising:
- an internal volume,
- a plurality of gas inject passages formed in the chamber body, and
- one or more gas exhaust passages formed in the chamber body;
- one or more heat sources configured to generate heat;
- a liner disposed in the internal volume and lining at least part of one or more sidewalls of the chamber body, the liner comprising an inner surface;
- a plate assembly disposed in the internal volume and at least partially defining a processing volume of the internal volume, the plate assembly comprising:
- an inner section comprising an opaque material,
- one or more outer sections that are arcuate in shape and comprise the opaque material, the one or more outer sections comprising an outermost section interfacing with the liner, and
- one or more spacers sized and shaped for disposition between the inner section and a first outer section of the one or more outer sections, the one or more spacers comprising a transparent material;
- and
- a substrate support assembly positioned in the processing volume, the substrate support assembly comprising:
- a plurality of lift pins, and
- one or more substrate supports.
Dependencies are inferred from the claim text.