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US 12,584,054 B2Granted
Semiconductor production device sealing material
AssigneeMitsubishi Cable Industries, Ltd.
InventorsHiroaki Yasuda, Takehiro Hamamura, Takao Ito
Life of this patent
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Abstract
A seal material for a semiconductor manufacturing device is made of a rubber composition containing fluororubber and phenol resin powder. The content of the phenol resin powder is 1 part by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the fluororubber. The average particle size of the phenol resin powder is 1 μm or more and 20 μm or less.
Claims3
A seal material for a semiconductor manufacturing device, the seal material being made of a rubber composition containing fluororubber and phenol resin powder, and a crosslinking agent,
- a content of the phenol resin powder being 1 part by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the fluororubber,
- an average particle size of the phenol resin powder being 1 μm or more and 6 μm or less,
- the phenol resin powder having a free phenol content of 500 parts per million or less, and
- the crosslinking agent being a polyol or a peroxide.
1 more element
Dependencies are inferred from the claim text.