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US 12,584,011 B2Granted
Epoxy resin composition, gas barrier laminate, and packaging material
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsNaoko Kobayashi, Kazuki Kouno, Ryoma Hashimoto
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Abstract
An epoxy resin composition containing an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and a polyalkylene glycol, as well as a gas barrier laminate and a packaging material in which the epoxy resin composition is used.
Claims10
An epoxy resin composition comprising an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and a polyalkylene glycol, and an unsaturated fatty acid amide having from 14 to 24 carbons,
- wherein a content of the unsaturated fatty acid amide in the epoxy resin composition is from 3.0 to 20.0 parts by mass per 100 parts by mass of a total amount of the epoxy resin and the nonvolatile content in the epoxy resin curing agent.
Dependencies are inferred from the claim text.