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US 12,583,983 B2Granted
Polyimide film having high dimensional stability, and method for manufacturing same
AssigneePI Advanced Materials Co., Ltd.
InventorsDong-Young Kim, Dae-Geon Yoo, Dong-Young Won
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Abstract
The present invention provides: a polyimide film having excellent dimensional stability; and a method for manufacturing same, wherein the polyimide film has a coefficient of thermal expansion of 1 ppm/° C. to 5 ppm/° C., an elastic modulus of 9 GPa to 11.5 GPa, and a glass transition temperature of 340° C. to 400° C.
Claims11
A polyimide film obtained by an imidization reaction of a polyamic acid solution comprising:
- an acid dianhydride component including at least two selected from the group consisting of biphenyltetracarboxylic dianhydride (BPDA), pyromellitic dianhydride (PMDA), oxydiphthalic dianhydride (ODPA), and benzophenonetetracarboxylic dianhydride (BTDA);
- and
- a diamine component including at least two selected from the group consisting of paraphenylene diamine (PPD), m-tolidine, oxydianiline (ODA), and 1,3-bisaminophenoxybenzene (TPE-R),
- wherein based on a total content of 100 mol % of the diamine component, the content of the paraphenylene diamine is 10 mol % or more and 70 mol % or less, and the content of the m-tolidine is 25 mol % or more and 80 mol % or less,
- wherein the polyimide film has a thermal expansion coefficient of 1 ppm/° C. or more and 5 ppm/° C. or less, an elastic modulus of 9 GPa or more and 11.5 GPa or less, and a glass transition temperature of 340° C. or more and 400° C. or less, and
- wherein based on a total content of 100 mol % of the acid dianhydride component, the content of the biphenyltetracarboxylic dianhydride is 30 mol % or more and 60 mol % or less, and the content of the pyromellitic dianhydride is 40 mol % or more and 60 mol % or less.
3 more elements
A method of manufacturing a polyimide film, the method comprising:
- (a) preparing a polyamic acid by polymerizing, in an organic solvent, an acid dianhydride component comprising at least two selected from the group consisting of biphenyltetracarboxylic dianhydride (BPDA), pyromellitic dianhydride (PMDA), oxydiphthalic dianhydride (ODPA), and benzophenontetracarboxylic dianhydride (BTDA), and a diamine component comprising at least two selected from the group consisting of paraphenylene diamine (PPD), m-tolidine, oxydianiline (ODA), and 1,3-bisaminophenoxybenzene (TPE-R);
- and
- (b) subjecting the polyamic acid to an imidization reaction,
- wherein based on a total content of 100 mol % of the acid dianhydride component, the content of the biphenyltetracarboxylic dianhydride is 30 mol % or more and 60 mol % or less, and the content of the pyromellitic dianhydride is 40 mol % or more and 60 mol % or less, and based on a total content of 100 mol % of the diamine component, the paraphenylene diamine is 10 mol % or more and 70 mol % or less, and the content of the m-tolidine is 25 mol % or more and 80 mol % or less, and wherein the polyimide film has a thermal expansion coefficient of 1 ppm/° C. or more and 5 ppm/° C. or less, an elastic modulus of 9 GPa or more and 11 GPa or less, and a glass transition temperature of 340° C. or more and 400° C. or less.
1 more element
Dependencies are inferred from the claim text.