US 12,583,211 B2 · Substrate support assembly with multiple discs

Abstract

A method for bonding components of an electrostatic chuck includes applying a first melting point depressing layer (MDL) to a bottom surface of a first puck plate including one or more functional elements of an electrostatic chuck. A second MDL is applied to a top surface of a second puck plate including one or more functional elements of the electrostatic chuck, and a metal interlayer is provided between the first MDL and the second MDL. The first puck plate, the metal interlayer, and the second puck plate are aligned to form a puck assembly, and the puck assembly is heated, to a temperature at or near the eutectic temperature of the first MDL or the second MDL, to thermally bond the first puck plate to the metal interlayer and the metal interlayer to the second puck plate.

Claims25

Dependent claims

A method, comprising:

applying a first melting point depressing layer (MDL) to a bottom surface of a first puck plate comprising one or more first functional elements of an electrostatic chuck;
applying a second MDL to a top surface of a second puck plate comprising one or more second functional elements of the electrostatic chuck;
inserting a metal interlayer between the first MDL and the second MDL;
aligning the first puck plate, the metal interlayer, and the second puck plate to form a puck assembly;
and
heating the puck assembly, to a temperature at or near an eutectic temperature of the first MDL or the second MDL, to thermally bond the first puck plate to the metal interlayer and the metal interlayer to the second puck plate.

3 more elements

Dependencies are inferred from the claim text.

Substrate support assembly with multiple discs

Life of this patent

Substrate support assembly with multiple discs

Life of this patent

Abstract

Claims25