Ultrasonic bonding method, ultrasonic bonding apparatus, and ultrasonic bonding system
AssigneeKabushiki Kaisha Toshiba
InventorsYuto Shinohara, Takahiro Aizawa, Takashi Ito
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Abstract
According to one embodiment, an ultrasonic bonding method for bonding a plurality of bonding members together by applying pressure and an ultrasonic wave includes a pressing step of applying pressure to one bonding member and another bonding member so as to press against each other, an application step of applying an ultrasonic wave to the one bonding member, a detection step of detecting a vibration state of another bonding member during the application step, and a step of determining a state of bonding between the bonding members based on the vibration state acquired in the detection step.
Claims15
An ultrasonic bonding process comprising:
- pressurizing a first bonding member against a second bonding member in a first direction for a period of time;
- while pressurizing the first bonding member against the second bonding member in the first direction during the period of time, applying ultrasonic waves to the second bonding member to cause vibration in the first bonding member in a second direction perpendicular to the first direction;
- determining a state of the vibration of the first bonding member in the second direction during the applying of the ultrasonic waves to the second bonding member;
- and
- determining a bonding state of the first bonding member and the second bonding member based on the determined state of the vibration.
An ultrasonic bonding apparatus comprising:
- a mechanical press configured to press a first bonding member against a second bonding member in a first direction;
- an ultrasonic wave generator configured to apply ultrasonic waves to the second bonding member in a second direction perpendicular to the first direction;
- a sensor configured to detect a state of vibration of the first bonding member in the second direction;
- and
- a processor configured to determine a bonding state between the first bonding member and the second bonding member based on the detected state of the vibration.
An ultrasonic bonding system comprising:
- a mechanical press configured to press a first bonding member against a second bonding member in a first direction;
- an ultrasonic wave generator configured to apply ultrasonic waves to the second bonding member in a second direction perpendicular to the first direction;
- a sensor configured to detect a state of vibration of the first bonding member in the second direction;
- and
- a control device configured to control the mechanical press and the ultrasonic wave generator to carry out a process including:
- pressurizing the first bonding member against the second bonding member in the first direction;
- while pressurizing the first bonding member against the second bonding member in the first direction for a period of time, applying ultrasonic waves to the second bonding member to cause vibration in the first bonding member in a second direction perpendicular to the first direction;
- and
- determining a bonding state of the first bonding member and the second bonding member based on the state of the vibration detected by the sensor during the applying of the ultrasonic waves to the second bonding member.
Dependencies are inferred from the claim text.