Cutting device and cutting method
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsRyuta Abe, Tatsuya Masada, Masahide Maruyama
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Abstract
A cutting device for cutting a continuous body of an electrode plate, the electrode plate including a current collector plate, a first active material layer, and a second active material layer, the cutting device including: a first process unit that causes a first cutting blade to form an incision in the first active material layer; and a second process unit that causes a second cutting blade to cut the continuous body.
Claims5
A cutting method for cutting a continuous body of an electrode plate, the electrode plate including a current collector plate having a first surface and a second surface facing away from each other, a first active material layer laminated on the first surface, the first active material layer having a third surface on a side opposite to the current collector plate, and a second active material layer laminated on the second surface, the second active material layer having a fourth surface on a side opposite to the current collector plate, the cutting method comprising:
- causing a first cutting blade to advance from the third surface of the first active material layer toward the current collector plate, the first cutting blade penetrating into the first active material layer to form an incision in the first active material layer without reaching the current collector plate;
- and
- causing a second cutting blade to advance from the fourth surface of the second active material layer toward the current collector plate, the second cutting blade penetrating through the current collector plate to reach the incision formed in the first active material layer to cut the continuous body.
Dependencies are inferred from the claim text.