Solder alloy, solder paste, and solder joint
AssigneeSenju Metal Industry Co., Ltd.
InventorsTakahiro Yokoyama, Shunsaku Yoshikawa, Yuki Iijima, Kanta Dei, Takahiro Matsufuji, Kota Sugisawa, Shigeto Suzuki
Life of this patent
Estimating the term…
Abstract
Provided are a solder alloy, a solder paste, and a solder joint that exhibit a suitable melting temperature, are excellent in wettability, are high in tensile strength and shear strength, and are further excellent in drop impact resistance. The solder alloy has the following alloy composition. The alloy composition has an alloy composition consisting of, by mass %, Ag: 0.1 to 3.9%, Cu: 0.1 to 1.0%, Bi: 0.6 to 1.4%, Sb: 5.1 to 7.9%, Ni: 0.01 to 0.30%, Co: 0.001 to 0.100% or less, with the balance being Sn.
Claims8
A solder alloy having an alloy composition consisting of, by mass %,
- Ag:
- 0.1 to 3.9%,
- Cu:
- 0.1 to 1.0%,
- Bi:
- 0.6 to 1.4%,
- Sb:
- 5.1 to 7.9%,
- Ni:
- 0.01 to 0.30%,
- Co:
- 0.001 to 0.100%, with the balance being Sn,
- wherein, in an evaluation of wettability, the solder alloy exhibits an average value of zero cross times (sec) of 1.5 seconds or less under the following test conditions:
- immersion speed into a solder bath:
- 10 mm/sec;
- immersion depth into the solder bath:
- 4 mm;
- immersion time into the solder bath:
- 10 sec;
- the solder bath temperature:
- 255° C.;
- and
- wherein, in an evaluation of high-speed shear test, a fracture mode after the high-speed shear test was performed at a shear speed of 4000 mm/sec is:
- (a) bulk fracture and joint interface fracture or (b) bulk fracture.
A solder alloy having an alloy composition consisting of, by mass %,
- Ag:
- 0.1 to 3.9%,
- Cu:
- 0.1 to 1.0%,
- Bi:
- 0.6 to 1.4%,
- Sb:
- 5.1 to 7.9%,
- Ni:
- 0.01 to 0.30%,
- at least one of In, Ga, As, Fe, Pd, Mn, Zn, Zr, and Mg:
- 0.1% or less in total,
- Co:
- 0.001 to 0.100%, with the balance being Sn,
- wherein, in an evaluation of wettability, the solder alloy exhibits an average value of zero cross times (sec) of 1.5 seconds or less under the following test conditions:
- immersion speed into a solder bath:
- 10 mm/sec;
- immersion depth into the solder bath:
- 4 mm;
- immersion time into the solder bath:
- 10 sec;
- the solder bath temperature:
- 255° C.;
- and
- wherein, in an evaluation of high-speed shear test, a fracture mode after the high-speed shear test was performed at a shear speed of 4000 mm/sec is:
- (a) bulk fracture and joint interface fracture or (b) bulk fracture.
Dependencies are inferred from the claim text.