Electronic component holding member and endoscope
AssigneeOlympus Medical Systems Corp.
InventorShigeru Hosokai
Life of this patent
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Abstract
An electronic component holding member includes a first base material including an electronic component, a first resin molded product, and first metal patterns in which a signal pattern and a grounding pattern are formed on a non-planar surface, a second base material including a second resin molded product, and a second metal pattern formed on a non-planar surface so as to overlap at least part of the first metal patterns, and grounding wiring configured to connect the grounding pattern and the second metal pattern.
Claims10
An electronic component holding member comprising:
- a first base material including
- an electronic component,
- a first resin molded product configured to hold the electronic component, and
- first metal patterns formed on a surface including a non-planar surface, of the first resin molded product, the first metal patterns including a signal pattern configured to perform signal transmission with the electronic component, and a grounding pattern;
- a second base material including
- a second resin molded product disposed on the first base material, and
- a second metal pattern formed on a surface including a non-planar surface, of the second resin molded product so as to overlap at least part of the first metal patterns with the second resin molded product between the second metal pattern and the at least part of the first metal patterns;
- and
- grounding wiring configured to connect the grounding pattern and the second metal pattern.
An endoscope equipped with an electronic component holding member comprising
- a first base material including
- an electronic component,
- a first resin molded product configured to hold the electronic component, and
- first metal patterns formed on a surface including a non-planar surface, of the first resin molded product, the first metal patterns including a signal pattern configured to perform signal transmission with the electronic component, and a grounding pattern,
- a second base material including
- a second resin molded product disposed on the first base material, and
- a second metal pattern formed on a surface including a non-planar surface, of the second resin molded product so as to overlap at least part of the first metal patterns with the second resin molded product between the second metal pattern and the at least part of the first metal patterns, and
- grounding wiring configured to connect the grounding pattern and the second metal pattern.
Dependencies are inferred from the claim text.