Image pickup unit having resin in via holes for an endoscope
AssigneeOlympus Corporation
InventorKeiichi Kobayashi
Life of this patent
Estimating the term…
Abstract
An image pickup unit includes: an image pickup substrate including a first principal surface and a second principal surface, a light receiving circuit being formed on the first principal surface and a through wiring being placed on an inner surface of a via hole including an opening in the second principal surface; a solder resist film placed around the via hole on the second principal surface and in the via hole in a range from a bottom face to a level not reaching the second principal surface; and a bonding terminal which is made of solder, covers a surface of the solder resist film placed in the via hole, and is bonded to the through wiring on an outer edge of the opening in the via hole, the through wiring being not covered with the solder resist film.
Claims10
A semiconductor apparatus comprising:
- a semiconductor substrate including a first principal surface and a second principal surface on a side opposite the first principal surface, a semiconductor circuit being formed on the first principal surface and a through wiring electrically continuous with the semiconductor circuit being placed on an inner surface of a via hole including an opening in the second principal surface;
- resin placed around the via hole on the second principal surface and in the via hole in a range from a bottom face to a level not reaching the second principal surface;
- and
- a bonding terminal which is made of solder, covers a surface of the resin placed in the via hole, and is bonded to the through wiring on an outer edge of the opening in the via hole, the through wiring being not covered with the resin.
An image pickup unit comprising:
- a semiconductor substrate including a first principal surface and a second principal surface on a side opposite the first principal surface, a light-receiving circuit being formed on the first principal surface and a through wiring electrically continuous with the light-receiving circuit being placed on an inner surface of a via hole including an opening in the second principal surface;
- resin placed around the via hole on the second principal surface and in the via hole in a range from a bottom face to a level not reaching the second principal surface;
- and
- a bonding terminal which is made of solder, covers a surface of the resin placed in the via hole, and is bonded to the through wiring on an outer edge of the opening in the via hole, the through wiring being not covered with the resin.
An endoscope comprising:
- an image pickup unit;
- and
- an insertion portion including the image pickup unit in a distal end portion,
- wherein the image pickup unit includes:
- a semiconductor substrate including a first principal surface and a second principal surface on a side opposite the first principal surface, a light-receiving circuit being formed on the first principal surface and a through wiring electrically continuous with the light-receiving circuit being placed on an inner surface of a via hole including an opening in the second principal surface,
- resin placed around the via hole on the second principal surface and in the via hole in a range from a bottom face to a level not reaching the second principal surface, and
- a bonding terminal which is made of solder, covers a surface of the resin placed in the via hole, and is bonded to the through wiring on an outer edge of the opening in the via hole, the through wiring being not covered with the resin.
A method for manufacturing a semiconductor apparatus comprising:
- producing a semiconductor substrate including a first principal surface and a second principal surface on a side opposite the first principal surface, a semiconductor device and an electrode connected to the semiconductor device being placed on the first principal surface;
- forming a via hole reaching the electrode, in the second principal surface;
- placing a through wiring on an inner surface of the via hole;
- coating part of the second principal surface which is around the via hole and an interior of the via hole in a range from a bottom face to a level not reaching the second principal surface with resin;
- and
- installing a bonding terminal which is made of solder, covers a surface of the resin in the via hole, and is bonded to the through wiring in an upper part of the via hole.
Dependencies are inferred from the claim text.