Power semiconductor device, power conversion device, and electric system
AssigneeHitachi Astemo, Ltd.
InventorsTakahiro Araki, Takeshi Tokuyama, Shigehisa Aoyagi, Noriyuki Maekawa
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AssigneeHitachi Astemo, Ltd.
InventorsTakahiro Araki, Takeshi Tokuyama, Shigehisa Aoyagi, Noriyuki Maekawa
Estimating the term…
A power semiconductor device includes: a substrate in which a positive electrode wiring connected to a first conductor on a high potential side and a negative electrode wiring connected to a fourth conductor on a low potential side are provided on one surface, and an output wiring connected to a second conductor and a third conductor is provided on the other surface so as to face the positive electrode wiring and the negative electrode wiring; and a first capacitor that smooths DC power supplied to a first upper-arm circuit body and a first lower-arm circuit body. The substrate is disposed between the first upper-arm circuit body and the first lower-arm circuit body. The first capacitor is disposed between the first upper-arm circuit body and the first lower-arm circuit body, and is connected to the positive electrode wiring and the negative electrode wiring on the substrate.
A power semiconductor device comprising a first upper-arm circuit body configured by sandwiching a first switching element constituting an upper-arm circuit between a first conductor and a second conductor, and a first lower-arm circuit body configured by sandwiching a second switching element constituting a lower-arm circuit between a third conductor and a fourth conductor, the power semiconductor device comprising:
Dependencies are inferred from the claim text.