Substrate processing method, substrate processing device, and processing fluid

A substrate processing apparatus comprising:

• a processing liquid supplying unit that includes a processing liquid nozzle which supplies a processing liquid to a front surface of a substrate;
• a processing film forming unit by which the processing liquid present on the front surface of the substrate is solidified or cured to form a processing film on the front surface of the substrate;
• an etching component forming processing unit which applies etching component forming processing to the processing film;
• a peeling liquid supplying unit that includes a peeling liquid nozzle which supplies to the front surface of the substrate a peeling liquid to peel the processing film from the front surface of the substrate;
• and
• a controller which controls the processing liquid supplying unit, the processing film forming unit, the etching component forming processing unit, and the peeling liquid supplying unit;
• wherein
• the controller is programmed so as to execute a processing film forming step in which the processing liquid is supplied from the processing liquid supplying unit to the front surface of the substrate and the processing liquid supplied to the front surface of the substrate is solidified or cured by the processing film forming unit to form the processing film on the front surface of the substrate, an etching component forming step in which the etching component forming processing is performed by the etching component forming processing unit to form an etching component in the processing film, an etching step in which a surface layer portion of the substrate is etched by the etching component that is formed in the etching component forming step, and a processing film removing step in which the peeling liquid is supplied from the peeling liquid supplying unit to the front surface of the substrate, thereby peeling the processing film from the front surface of the substrate and removing the processing film from the front surface of the substrate,
• the controller is further programmed to execute a high solubility component forming step in which after the etching component forming step and before the processing film removing step, the processing film is subjected to high solubility component forming processing, thereby forming in the processing film a first high solubility component which is higher in solubility with respect to the peeling liquid than other components in the processing film,
• in the processing film removing step, the peeling liquid is supplied to the front surface of the substrate, thereby dissolving the first high solubility component in the processing film, and
• in the processing film forming step, the processing film is formed which contains a first low solubility component that is different from the first high solubility component and that is lower in solubility with respect to the peeling liquid than the first high solubility component.