Imaging device comprising net shape wiring
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsYuki Okamoto, Yoshiyuki Kurokawa, Hiroki Inoue, Takuro Ohmaru
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AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsYuki Okamoto, Yoshiyuki Kurokawa, Hiroki Inoue, Takuro Ohmaru
Estimating the term…
A solid-state imaging device with high productivity and improved dynamic range is provided. In the imaging device including a photoelectric conversion element having an i-type semiconductor layer, functional elements, and a wiring, an area where the functional elements and the wiring overlap with the i-type semiconductor in a plane view is preferably less than or equal to 35%, further preferably less than or equal to 15%, and still further preferably less than or equal to 10% of the area of the i-type semiconductor in a plane view. Plural photoelectric conversion elements are provided in the same semiconductor layer, whereby a process for separating the respective photoelectric conversion elements can be reduced. The respective i-type semiconductor layers in the plural photoelectric conversion elements are separated by a p-type semiconductor layer or an n-type semiconductor layer.
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.