Method and apparatus to enhance semiconductor device manufacturing
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYao-Ren Kuo, Chih-Wei Wen, Kun-Lung Hsieh, Tzu Han Liu, Hung-Jui Chang
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Abstract
Pellicles are inspected by projecting a light pattern thereon and monitoring the reflected light by CCD module or the like. Software-based inspection of the reflected pattern recognizes any distortions in the pattern or contamination, and thus identifies wrinkles or other defects in the pellicle prior to use in the manufacturing process. Recognition of defects and replacement will avoid instances of pellicle rupture thereby avoiding damage to wafers being patterned.
Claims20
A method for enhancing a semiconductor device manufacturing process, comprising:
- placing a pellicle on a surface of a mask;
- projecting a pattern on a surface of the pellicle, wherein projecting the pattern comprises:
- activating a light source;
- and
- directing light through a surface of a transparent film having the pattern at an angle of incidence of between 5 degrees and 85 degrees;
- measuring a reflection of the pattern from the pellicle;
- and
- performing the semiconductor device manufacturing process when a discrepancy between the measured reflection and stored values of the pattern is within a predetermined tolerance limit.
A method for enhancing a semiconductor device manufacturing process, comprising:
- placing a pellicle on a surface of a mask,
- wherein the pellicle includes a membrane disposed over a frame;
- casting a shadow of a pattern on a surface of the membrane, wherein casting a shadow of the pattern comprises activating a light source and directing light through a surface of a transparent film having the pattern at an angle of incidence between 5 degrees and 85 degrees, and an angle of reflection of the pattern from the surface of the membrane is between 5 degrees and 85 degrees;
- detecting an image of the shadow of the pattern using an optical sensor;
- measuring features of the shadow of the pattern;
- comparing the measured features with stored values of the pattern;
- and
- performing the semiconductor device manufacturing process when a discrepancy between the measured features and the stored values of the pattern is within a predetermined tolerance limit.
A method for enhancing a semiconductor device manufacturing process, comprising:
- placing a pellicle on a surface of a mask;
- projecting a pattern on a surface of the pellicle, wherein the pattern includes a plurality of concentric circles, and projecting the pattern comprises:
- activating a light source;
- and
- directing light through a surface of a transparent film having the pattern at an angle of incidence between 5 degrees and 85 degrees, and an angle of reflection of the pattern from the surface of the pellicle is between 5 degrees and 85 degrees;
- measuring a reflection of the pattern from the pellicle;
- and
- performing the semiconductor device manufacturing process when a discrepancy between the measured reflection and stored values of the pattern is within a predetermined tolerance limit.
Dependencies are inferred from the claim text.