US 12,581,743 B2Granted

Electronic component and apparatus

AssigneeTDK Corporation

InventorsKazuhiro Yoshikawa, Takeshi Oohashi, Koichi Tsunoda, Mitsuhiro Tomikawa

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Abstract

Disclosed herein is an electronic component that includes: a substrate; a capacitor on the substrate; a first insulating resin layer embedding therein the capacitor; an inductor provided on the first insulating resin layer and connected to the capacitor, the inductor including a conductor pattern; a second insulating resin layer embedding therein the inductor; a third insulating resin layer on the second insulating resin layer; a post conductor having a lower end and an upper end and penetrating the third insulating resin layer such that the lower end of the post conductor is connected to the inductor; and a terminal electrode on the third insulating resin layer and connected to the upper end of the post conductor. In a thickness direction of the substrate, the height of the post conductor is larger than a thickness of a conductor pattern constituting the inductor.

Claims19

Dependent claims

An electronic component comprising:

a substrate;
a capacitor on the substrate;
a first insulating resin layer embedding therein the capacitor;
an inductor including a first conductor pattern on the first insulating resin layer and a via conductor connected to the capacitor so as to penetrate the first insulating resin layer;
a second insulating resin layer embedding therein the inductor;
a third insulating resin layer on the second insulating resin layer;
a post conductor having a lower end and an upper end and penetrating the third insulating resin layer such that the lower end of the post conductor is connected to the first conductor pattern of the inductor;
and
a terminal electrode on the third insulating resin layer and connected to the upper end of the post conductor,
wherein, in a thickness direction of the substrate, a height of the post conductor is larger than a thickness of the first conductor pattern of the inductor, and
wherein, in the thickness direction of the substrate, the thickness of the first conductor pattern is larger than a thickness of the via conductor.

8 more elements

An electronic component comprising:

a substrate;
a first insulation layer on the substrate, the first insulation layer including at least a first layer and a second layer on the first layer;
a second insulation layer on the first insulation layer;
a capacitor on the substrate and embedded in the first layer of the first insulation layer;
an inductor having one or more conductor layers of conductor patterns embedded in at least the second layer of the first insulation layer, a part of the one or more conductor layers of conductor patterns electrically connected to the capacitor;
a post conductor having a lower end and an upper end and penetrating the second insulation layer, the lower end of the post conductor being electrically connected to the inductor, a length between the lower end and the upper end of the post conductor being larger than a thickness of a sum of the first layer and the second layer of the first insulation layer;
and
a terminal electrode on the second insulating layer and electrically connected to the upper end of the post conductor.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 18/589,812Filed 28 Feb 2024 · continuation
Priority: JP 2021-14098731 Aug 2021
Published: US 2024/0203972 A120 Jun 2024
Granted: 17 Mar 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification15 codes

H10D 86/85
Characterised by multiple passive components, e.g. resistors, capacitors or inductors: characterised by only passive components
H05K 3/46
Apparatus or processes for manufacturing printed circuits: manufacturing multilayer circuits
H10D 84/01
Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers:…
H10D 86/01
Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless…