Carrier substrate, laminate, and method for manufacturing electronic device

A method for manufacturing an electronic device, the method comprising:

• forming a member for an electronic device on a surface of a substrate of a laminate comprising a carrier substrate and the substrate formed on the carrier substrate to obtain a member for an electronic device-attached-laminate;
• and
• removing the carrier substrate from the member for an electronic device-attached-laminate to obtain an electronic device having the substrate and the member for an electronic device,
• wherein the carrier substrate comprises at least a first glass substrate,
• the first glass substrate has a compaction of from 20 to 80 ppm, wherein the compaction is determined as a shrinkage when subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour,
• the first glass substrate comprises a glass comprising, in terms of mass percentages based on oxides, the following:
• from 57% to 62.1% of SiO2,
• from 19% to 24% of Al2O3,
• from 2.6% to less than 5% of B2O3,
• from 2% to 6% of MgO,
• from 4.1% to 7% of CaO,
• from 2.3% to 9% of SrO,
• from 1% to 10% of BaO, and
• from 14% to 16% of MgO+CaO+SrO+BaO, and
• the first glass substrate has a strain point of at least 700° C.