High density radio frequency connections
AssigneeLockheed Martin Corporation
InventorsTimothy Patrick Wink, Frank Lucchesi, Bradley Frank Allen, Nathan Jastram
Life of this patent
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AssigneeLockheed Martin Corporation
InventorsTimothy Patrick Wink, Frank Lucchesi, Bradley Frank Allen, Nathan Jastram
Estimating the term…
Provided herein are various enhancements for coupling radio frequency signals among components of aperture antenna arrays and electronically steered arrays (ESAs). An apparatus is provided having a first printed circuit board comprising stripline links arranged to carry radio frequency signals routed to a connector configured to couple to a mating connector on a second printed circuit board. Connections of the connector are arranged to carry the radio frequency signals to the second printed circuit board using at least a connection arrangement having a perimeter of radio frequency ground connections surrounding a set of radio frequency connections configured to carry the radio frequency signals, with each of the radio frequency connections of the set spaced apart within the perimeter by additional instances of the radio frequency ground connections such that a target signal isolation among individual ones of the radio frequency signals is established.
An apparatus, comprising:
A method of coupling radio frequency signaling among printed circuit boards, the method comprising:
An antenna subarray, comprising:
Dependencies are inferred from the claim text.