Filter, manufacturing method therefor and electronic device

A method for manufacturing a filter, comprising:

• manufacturing a first substrate, a second substrate and a connection substrate, respectively, wherein at least one first substrate electrode is provided on the first substrate, at least one second substrate electrode is provided on the second substrate, the connection substrate comprises, at least, a connection base substrate and at least one conductive post penetrating through the connection base substrate, an end of the conductive post close to the first substrate is connected with a first bump structure, and an end of the conductive post close to the second substrate is connected with a second bump structure;
• and
• disposing the first substrate and the second substrate oppositely to each other, disposing the connection substrate between the first substrate and the second substrate, connecting the first bump structure with the first substrate electrode in a bonding manner, and connecting the second bump structure with the second substrate electrode in a bonding manner,
• wherein the first substrate is further provided with a filter capacitor;
• wherein the first substrate comprises, at least, a first base substrate, a first conductive layer disposed on a side of the first base substrate close to the connection substrate, a second conductive layer disposed on a side of the first conductive layer close to the connection substrate, a third conductive layer disposed on a side of the second conductive layer close to the connection substrate;
• and
• wherein the filter capacitor comprises a first plate and a second plate, an orthographic projection of the first plate on the first base substrate is overlapped, at least partially, with an orthographic projection of the second plate on the first base substrate, the first plate is disposed in the second conductive layer, and the second plate is disposed in the third conductive layer.