Apparatus for treating substrate and method for measuring degree of wear of consumable component

An apparatus for treating a substrate, the apparatus comprising:

• a process chamber having a process space;
• a gas supply unit configured to supply a process gas into the process space;
• a power supply unit configured to excite the process gas into plasma;
• a support unit configured to support the substrate in the process space;
• a lift pin module including a first lift pin configured to move a ring member on the support unit in an up/down direction and a lifting unit configured to raise and lower the first lift pin;
• and
• a measurement unit configured to measure an etch amount of the ring member, the measurement unit having a light receiving member configured to receive light emitted in a horizontal direction,
• a substrate lift module configured to vertically move the substrate placed on the support unit, and
• a view port on which the light receiving member is installed,
• wherein an irradiation member configured to emit the light is attached to a substrate type sensor transported into the process space and configured to monitor a substrate treating process performed in the process chamber,
• wherein the apparatus further comprises a controller,
• wherein
• when measuring a degree of wear of the ring member, the controller is configured to control the substrate lift module to raise the substrate type sensor to a height corresponding to the view port, and
• control the lift pin module to move the ring member upward to a position where the ring member interferes with the light,
• wherein the light emitted by the irradiation member is a laser, and
• wherein, in the measuring the degree of wear of the ring member,
• the position where the ring member interferes with the light is a position such that an upper surface of the first lift pin of the lift pin module is above an upper surface of the support unit, and
• the height corresponding to the view port is a height such that an upper surface of a second lift pin of the substrate lift module is above the upper surface of the support unit.