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US 12,580,144 B2Granted
Electronic module
AssigneeRobert Bosch GmbH
InventorsOliver Raab, Stefan Kiefl, Markus Schwarz
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Abstract
Various embodiments of the teachings herein include an electronic module comprising a microelectromechanical system (MEMS) switch with a substrate and a semiconductor component. The semiconductor component is formed with the substrate and connected to MEMS switch. The semiconductor component includes a diode. The substrate is formed from or with a silicon-on-insulator-wafer and/or silicon-on-insulator substrate.
Claims10
An electronic module comprising:
- a microelectromechanical system (MEMS) switch configured to open when voltages of matching polarity are applied to a first control contact and a second control contact;
- a substrate;
- and
- a semiconductor component including a diode configured to provide overvoltage protection;
- wherein the semiconductor component is formed with the substrate and connected to the MEMS switch;
- and
- wherein the substrate comprises a silicon-on-insulator-wafer and/or silicon-on-insulator substrate.
4 more elements
Dependencies are inferred from the claim text.