Inlet and card medium
AssigneeToppan Holdings Inc.
InventorsYukiko Katano, Shin Kataoka, Shigeki Minemura
Life of this patent
Estimating the term…
Abstract
An inlet embedded in a card medium, the inlet including: an exposed component at least partially exposed on a front surface of the card medium; a circuit board including a board wiring part to which the exposed component is bonded on a front surface side, the circuit board being provided closer to a back surface of the card medium than the exposed component is; and a sheet circuit board provided closer to the front surface than the circuit board is, the sheet circuit board including a sheet wiring part electrically connected to the board wiring part on a back surface side, and a sheet including at least one sheet through hole through which the exposed component can pass.
Claims8
An inlet embedded in a card medium, comprising:
- an exposed component at least partially exposed on a front surface of the card medium;
- a circuit board including a board wiring part to which the exposed component is bonded on a front surface side, the circuit board being provided closer to a back surface of the card medium than the exposed component is;
- and
- a sheet circuit board provided closer to the front surface than the circuit board is, the sheet circuit board comprising
- a sheet body;
- a sheet wiring part electrically connected to the board wiring part on a back surface side, and
- a sheet including at least one sheet through hole through which the exposed component can pass, wherein the exposed component comprises a biometric sensor that detects biometric information of a user, the biometric sensor is a semiconductor device electrically connected to the board wiring part;
- and the biometric sensor is at least partially exposed on the front surface of the card medium.
A card medium, comprising:
- an inlet;
- an upper external base material;
- and
- a lower external base material,
- wherein the inlet includes
- an exposed component at least partially exposed on a front surface of the card medium,
- a circuit board including a board wiring part to which the exposed component is bonded on a front surface side, the circuit board being provided closer to a back surface of the card medium than the exposed component is, and
- a sheet circuit board provided closer to the front surface than the circuit board is, the sheet circuit board comprising
- a sheet body;
- a sheet wiring part electrically connected to the board wiring part, and
- a sheet including at least one sheet through hole through which the exposed component can pass,
- the upper exterior base material is provided closer to the front surface than the inlet is, and includes at least one penetrable external through hole at substantially the same position as the sheet through hole, and
- the lower exterior base material is provided closer to the back surface than the inlet is, wherein the exposed component comprises a biometric sensor that detects biometric information of a user, the biometric sensor is a semiconductor device electrically connected to the board wiring part;
- and the biometric sensor is at least partially exposed on the front surface of the card medium.
Dependencies are inferred from the claim text.