Fingerprint sensor package and smart card including the same

A fingerprint sensor package comprising:

• a first substrate including a first bonding pad;
• a second substrate disposed on the first substrate, and including a plurality of first sensing patterns, a plurality of second sensing patterns, a second bonding pad, and a test pad;
• a controller chip disposed on the second substrate;
• a wire connected to the first bonding pad and the second bonding pad;
• and
• a molding layer covering the controller chip,
• wherein the plurality of second sensing patterns are disposed on the plurality of first sensing patterns and are spaced apart from the plurality of first sensing patterns,
• the plurality of first sensing patterns are spaced apart from each other in a first direction, and extend in a second direction that is different from the first direction,
• the plurality of second sensing patterns are spaced apart from each other in the second direction, and extend in the first direction, and
• the test pad is disposed between the second bonding pad and the controller chip.

A fingerprint sensor package comprising:

• a first substrate including a first bonding pad;
• a second substrate disposed on the first substrate, and including a plurality of first sensing patterns, a plurality of second sensing patterns, a second bonding pad, and a test pad;
• a controller chip disposed on the second substrate;
• and
• a wire connected to the first bonding pad and the second bonding pad,
• wherein the plurality of second sensing patterns are disposed on the plurality of first sensing patterns and are spaced apart from the plurality of first sensing patterns,
• the plurality of first sensing patterns are spaced apart from each other in a first direction, and extend in a second direction that is different from the first direction,
• the plurality of second sensing patterns are spaced apart from each other in the second direction, and extend in the first direction,
• the plurality of first sensing patterns include a first pattern, and the plurality of second sensing patterns include a second pattern,
• the first pattern and the second pattern define a first capacitor, the first pattern being a first electrode of the first capacitor, the second pattern being a second electrode of the first capacitor, and
• the test pad is disposed between the second bonding pad and the controller chip.