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US 12,578,466 B2Granted
Linear array ultrasonic probe
AssigneeShenzhen Mindray Bio-Medical Electronics Co., Ltd.
InventorsJinchi Wang, Nan Chen, Fei Wu, Ming Tang, Xuedong Liu
Life of this patent
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Abstract
Disclosed is a linear array ultrasonic probe, of which a first conductive layer is arranged on an outer wall of a backing body facing an array element layer by means of a gold spraying, electroplating, or chemical plating process, and/or a second conductive layer is arranged on a negative end by means of a gold spraying, electroplating, or chemical plating process, so that a thickness of at least one of the first conductive layer and the second conductive layer can be made thinner, for example, the thickness a≤5 micrometers.
Claims20
A linear array ultrasonic probe, comprising:
- an array element layer having a plurality of array elements, each of the array elements comprising a positive end and a negative end;
- a backing layer having a backing body, with the positive end of the array element arranged on the backing body;
- a matching layer arranged on the negative end;
- and
- a circuit board having a positive electrode connection circuit and a negative electrode connection circuit, the positive electrode connection circuit connected to the positive end, and the negative electrode connection circuit connected to the negative end;
- wherein
- a first conductive layer is provided on an outer wall of the backing body facing the array element layer, the positive end of the array element is arranged on the first conductive layer, and the positive electrode connection circuit is connected to the positive end via the first conductive layer;
- and a second conductive layer is provided on the negative end of the array element, and the negative electrode connection circuit is connected to the negative end via the second conductive layer;
- a thickness of the first conductive layer is less than or equal to 5 micrometers, and/or a thickness of the second conductive layer is less than or equal to 5 micrometers;
- and
- the first conductive layer is arranged on the outer wall of the backing body facing the array element layer by a gold spraying, electroplating, or chemical plating process;
- and/or the second conductive layer is arranged on the negative end by a gold spraying, electroplating, or chemical plating process,
- wherein the linear array ultrasonic probe further comprises an insulator provided on at least one side of the array element layer, a third conductive layer is arranged on an outer wall of the insulator and extends from the outer wall of the insulator to the circuit board, the second conductive layer is connected to the third conductive layer so as to be connected to the negative electrode connection circuit of the circuit board via the third conductive layer, and
- the insulator insulates the second conductive layer and the third conductive layer from the first conductive layer.
11 more elements
A linear array ultrasonic probe, comprising:
- an array element layer having a plurality of array elements, each of the array elements comprising a positive end and a negative end;
- a backing layer having a backing body, with the positive end of the array element arranged on the backing body;
- a matching layer arranged on the negative end;
- and
- a circuit board having a positive electrode connection circuit and a negative electrode connection circuit, the positive electrode connection circuit connected to the positive end, and the negative electrode connection circuit connected to the negative end;
- wherein
- a first conductive layer is provided on an outer wall of the backing body facing the array element layer, the positive end of the array element is arranged on the first conductive layer, and the positive electrode connection circuit is connected to the positive end via the first conductive layer;
- and a second conductive layer is provided on the negative end of the array element, and the negative electrode connection circuit is connected to the negative end via the second conductive layer;
- the first conductive layer is attached to the outer wall of the backing body facing the array element layer so as to be integral with the outer wall of the backing body;
- and/or the second conductive layer is attached to the negative end so as to be integral with the negative end;
- and wherein
- the first conductive layer is arranged on the outer wall of the backing body facing the array element layer by a gold spraying, electroplating, or chemical plating process;
- and/or the second conductive layer is arranged on the negative end by a gold spraying, electroplating, or chemical plating process,
- wherein the linear array ultrasonic probe further comprises an insulator provided on at least one side of the array element layer, a third conductive layer is arranged on an outer wall of the insulator and extends from the outer wall of the insulator to the circuit board, the second conductive layer is connected to the third conductive layer so as to be connected to the negative electrode connection circuit of the circuit board via the third conductive layer, and
- the insulator insulates the second conductive layer and the third conductive layer from the first conductive layer.
12 more elements
A linear array ultrasonic probe, comprising:
- an array element layer having a plurality of array elements, each of the array elements comprising a positive end and a negative end;
- a backing layer having a backing body, with the positive end of the array element arranged on the backing body;
- a matching layer arranged on the negative end;
- and
- a circuit board having a positive electrode connection circuit and a negative electrode connection circuit, the positive electrode connection circuit connected to the positive end, and the negative electrode connection circuit connected to the negative end;
- wherein
- a first conductive layer is provided on an outer wall of the backing body facing the array element layer, the positive end of the array element is arranged on the first conductive layer, and the positive electrode connection circuit is connected to the positive end via the first conductive layer;
- and a second conductive layer is provided on the negative end of the array element, and the negative electrode connection circuit is connected to the negative end via the second conductive layer;
- the first conductive layer is attached to the outer wall of the backing body facing the array element layer and is integral with the outer wall of the backing body;
- and/or the second conductive layer is attached to the negative end and is integral with an end face of the negative end,
- wherein the linear array ultrasonic probe further comprises an insulator provided on at least one side of the array element layer, a third conductive layer is arranged on an outer wall of the insulator and extends from the outer wall of the insulator to the circuit board, the second conductive layer is connected to the third conductive layer so as to be connected to the negative electrode connection circuit of the circuit board via the third conductive layer, and
- the insulator insulates the second conductive layer and the third conductive layer from the first conductive layer.
9 more elements
Dependencies are inferred from the claim text.