Method for preparing copper-plated titanium alloy wire reinforced aluminum-based composite material

A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material, comprising the following steps of:

• step 1:
• pretreating a TC4 wire, comprising etching a cleaned TC4 wire;
• wherein, in the step 1, pretreating the TC4 wire comprises:
• grinding the surface of the TC4 wire by a piece of sand paper, then pickling with H2SO4, degreasing with NaOH, cleaning with ethyl alcohol, drying, and finally etching, wherein the concentration of H2SO4 is 5 wt % to 10 wt %, and the concentration of NaOH is 1 wt % to 3 wt %;
• and the cleaned TC4 wire is etched using an etching solution, the etching temperature is 35° C. to 50° C. and the etching time is 15 min to 30 min;
• the etching solution is composed of 10 wt %-15 wt % HF aqueous solution, 10 wt % NH4HF2, 70 wt % ethylene glycol and 5 wt %-10 wt % H20 and the total mass percentage of the etching solution is 100%;
• wherein the volume concentration of the HF aqueous solution is 40%, thereby forming an etched TC4 wire;
• step 2:
• electroplating a copper layer on the etched TC4 wire to obtain a copper-plated titanium alloy wire;
• wherein the etched TC4 wire has a diameter of 0.2 mm to 0.5 mm and a copper-plated layer of the copper-plated titanium alloy wire has a thickness of 50 μm to 80 μm:
• wherein, in the step 2, during electroplating the copper layer on the etched TC4 wire, an electroplating solution is composed of 55 wt %-83 wt % CuSO4·5H20, 14 wt %-42 wt % H2SO4, <1 wt % emulsifier, <1 wt % sodium sulfonate and <1 wt % sodium chloride, and the total mass percentage of the electroplating solution is 100%, the electroplating temperature is 60° C. to 80° C., the electroplating current is 0.01 A to 0.09 A and the electroplating time is 30 min to 120 m;
• step 3:
• performing heat treatment with two-step slow cooling on the copper-plated titanium alloy wire by using a heat treatment furnace, comprising raising the furnace temperature to 820° C. to 880° C. at 100 C/min, keeping the temperature for 15 min to 60 min, then performing two-stage slow cooling, and finally cooling to room temperature along with the furnace;
• wherein, in the step 3, before raising the furnace temperature to 820° C. to 880° C., the furnace temperature is raised to 740° C. at 10° C./min and kept for 10 min, the cooling speed in the two-stage slow cooling is 5° C./min and the temperature is cooled from 820° C.-880° C. to 740° C. and kept for 5 min in a first stage and cooled from 740° C. to 500° C. in a second stage;
• and step 4:
• cladding a single-layer and single-pass ER5356 aluminum alloy on an aluminum alloy substrate by an arc additive manufacturing technology, then spreading the heat-treated copper-plated titanium alloy wire in the center of the single-layer to form an intermediate layer and finally cladding the single-layer and single-pass ER5356 aluminum alloy matrix on the surface of the intermediate layer.