CVD reactor having means for locally influencing the susceptor temperature
AssigneeAixtron SE
InventorPeter Sebald Lauffer
Life of this patent
Estimating the term…
Abstract
In the thermal treatment of substrates, a susceptor is used to hold at least one substrate. The susceptor can be heated with a heater and driven in rotation about a rotation axis by a rotary drive. Means are provided to influence the heat transfer to or from the susceptor in a locally limited manner, synchronized with the rotary movement of the susceptor, to equalize local temperature differences on the rotating susceptor. In particular, a temperature control gas with changing heat conduction properties is periodically fed in a pulsed manner through a feed opening into a gap between the susceptor and a cooling unit.
Claims13
A device for a thermal treatment of substrates, the device comprising:
- a housing (1);
- a radio frequency (RF) heater (13) being located in the housing (1);
- a rotary drive (20);
- a susceptor (5) that is heated by the RF heater (13), and is rotated about a first axis of rotation (A) by the rotary drive (20) with respect to the housing (1);
- a rotary encoder configured to determine an angular position of the susceptor (5);
- a control unit configured to receive the angular position from the rotary encoder;
- at least one substrate holder (7) disposed on the susceptor (5), the at least one substrate holder (7) for holding at least one substrate;
- and
- means (14, 14′) for influencing a temperature of a first region of the susceptor (5), wherein the control unit is configured to control the means (14, 14′) to influence a heat transfer from the susceptor (5) to a cooling unit (30) by altering, in a pulsed manner synchronized with a rotation of the susceptor (5), a thermal conductivity of a medium arranged between the susceptor (5) and the cooling unit (30) in a thermal influence zone (17), and wherein the thermal influence zone (17) is locally fixed in location with respect to the housing (1).
A device for a thermal treatment of substrates, the device comprising:
- a housing (1);
- a heater (13) being located in the housing (1);
- a rotary drive (20);
- a susceptor (5) that is heated by the heater (13) and is rotated about a first axis of rotation (A) by the rotary drive (20) with respect to the housing (1);
- a cooling unit (30) arranged below the susceptor (5);
- a rotary encoder configured to determine an angular position of the susceptor (5);
- a control unit configured to receive the angular position from the rotary encoder;
- at least one substrate holder (7), arranged eccentrically with respect to the first axis of rotation (A) on the susceptor (5), and which is rotated about a second axis of rotation (B) offset from the first axis of rotation (A), the at least one substrate holder (7) for holding at least one substrate;
- and
- means (14, 14′) being controlled by the control unit for influencing a heat transfer from the susceptor (5) to the cooling unit (30) by altering a thermal conductivity of a medium in a first thermal influence zone (17) disposed radially inwards from, or outwards from, or on, an orbital path of the second axis of rotation (B) about the first axis of rotation (A), wherein the medium is arranged between the susceptor (5) and the cooling unit (30), and wherein the first thermal influence zone (17) is locally fixed in location with respect to the housing (1).
Dependencies are inferred from the claim text.