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US 12,577,152 B2Granted
Processing apparatus and processing method
AssigneeSamsung Display Co., Ltd.
InventorsJeongjin Park, Yong-Hoon Kwon, Byunghoon Kim, Taeoh Kim
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Abstract
A processing apparatus includes a first processing unit to spray a mixture into a first region of a processing target, and a second processing unit to irradiate a beam into the first region of the processing target, and maintain a temperature of the first region to a predetermined temperature or more, in which the predetermined temperature is for ion-exchange between the processing target and some materials of the mixture.
Claims9
A processing method using a processing apparatus, the processing method comprising:
- pre-processing a processing target;
- and
- cutting and post-processing the processing target,
- wherein the cutting and the post-processing the processing target includes:
- irradiating a beam into a first region of the processing target;
- providing a first material to the first region in a manner that the first material forms a predetermined cut surface in the first region;
- providing a second material different from the first material to the first region;
- and
- healing and tempering the predetermined cut surface by the second material,
- wherein the providing the first material and the providing the second material are simultaneously performed,
- wherein the cutting and the post-processing the processing target further includes:
- healing and tempering the predetermined cut surface through an additional processing apparatus, and
- wherein the additional processing apparatus sprays the second material in a direction tilted relative to a direction normal to the processing target at a predetermined angle.
10 more elements
Dependencies are inferred from the claim text.