Conveying apparatus and peeling apparatus

A peeling apparatus for peeling off a wafer to be manufactured from an ingot having a peeling layer formed therein, the peeling layer being formed by applying a laser beam of such a wavelength as to be transmitted through the ingot to the ingot with a focal point of the laser beam positioned inside the ingot at a depth corresponding to a thickness of the wafer to be manufactured from an end face of the ingot, the peeling apparatus comprising:

• a holding table that holds the ingot;
• and
• a conveying apparatus disposed to face the holding table,
• wherein the conveying apparatus includes:
• a holding unit that holds the wafer under suction, the holding unit including a holding plate that holds the plate-shaped workpiece,
• a moving unit that moves in a vertical direction together with the holding unit,
• a detection unit that detects that the holding unit has moved downward and made initial contact with the wafer by detecting a predetermined variation in a distance between the moving unit and the holding plate and that the moving amount will not vary any more and vertical movement of the holding plate relative to the plate-shaped workpiece is restricted, wherein the detection unit moves in the vertical direction together with the moving unit;
• and
• a control unit that performs control to stop a downward movement of the moving unit and the detection unit when the detection unit detects that the holding unit has made the initial contact with the wafer, such that upon the initial contact between the plate-shaped workpiece and the holding plate, the holding plate holds the plate-shaped workpiece under suction.

A conveying apparatus for conveying a plate-shaped workpiece by holding the plate-shaped workpiece by a holding unit, the conveying apparatus comprising:

• the holding unit that holds the plate-shaped workpiece under suction, wherein the holding unit includes:
• a holding plate that holds the plate-shaped workpiece,
• a plurality of pin members formed upright on the holding plate and having a lower end portion provided fixedly on an upper surface of the holding plate,
• a first plate that is provided above the holding plate and that is formed with a plurality of through-holes allowing the pin members to pass therethrough, and
• a second plate that is provided above the first plate and that is connected to the pin members, and
• a moving unit that moves in a vertical direction together with the holding unit, wherein the first plate and the moving unit are connected to each other and move together;
• a detection unit that detects that the holding unit has moved downward and made contact with the plate-shaped workpiece;
• and
• a control unit that performs control to stop a downward movement of the moving unit when the detection unit detects that the holding unit has made contact with the plate-shaped workpiece, wherein the pin members and the second plate are connected to each other via elastic members which are provided between upper end portions of the pin members and a lower surface of the second plate.