Sheet for packaging electronic part
AssigneeDenka Company Limited
InventorsTakeshi Saito, Ikuka Inoda, Ryosuke Yanaka
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Abstract
An electronic device packaging sheet including a substrate sheet having at least one substrate layer including: a thermoplastic resin (I); and a resin (II) which includes at least one copolymer selected from a (meth)acrylic acid alkyl ester copolymer (A) and a styrene-acrylonitrile copolymer (B) that have a weight-average molecular weight of 700,000-4,300,000. The substrate sheet has at least one substrate layer comprising the thermoplastic resin (I) at 70-99 mass % and the resin (II) at 1-30 mass %.
Claims20
An electronic device packaging sheet comprising a substrate sheet having at least one substrate layer comprising:
- a thermoplastic resin (I);
- and a resin (II) which comprises at least one copolymer selected from a (meth)acrylic acid alkyl ester copolymer (A) and a styrene-acrylonitrile copolymer (B) that have a weight-average molecular weight of 700,000-4,300,000.
Dependencies are inferred from the claim text.