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US 12,576,474 B2Granted
Modification method of polyurethane, polyurethane, polishing pad, and modification method of polishing pad
AssigneeKuraray Co., Ltd.
InventorsAzusa Oshita, Mitsuru Kato, Minori Takegoshi, Chihiro Okamoto, Shinya Kato
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Abstract
A modification method of a polyurethane, including the steps of: preparing a polyurethane having an ethylenically unsaturated bond; and treating the polyurethane with a liquid containing a compound having a conjugated double bond, or a modification method of a polyurethane, including the steps of: preparing a polyurethane having a conjugated double bond; and treating the polyurethane with a liquid containing a compound having an ethylenically unsaturated bond is used.
Claims6
A polishing pad comprising,
- in at least a polishing surface thereof, a polyurethane having an ethylenically unsaturated bond,
- wherein a compound having a conjugated double bond and a functional group selected from the group consisting of a carboxyl group, a metal salt of a carboxyl group, a hydroxyl group, an amino group, a sulfonic acid group, a phosphoric acid group and an imidazole group is added to the ethylenically unsaturated bond to obtain a Diels Alder ring substituted with the functional group.
A polishing pad comprising,
- in at least a polishing surface thereof, a polyurethane having an ethylenically unsaturated bond,
- wherein the polyurethane comprises a polymer constituent unit derived from at least one compound selected from the group consisting of cis-2-butene-1,4-diol, 4,5-bis(hydroxymethyl) imidazole, 5-norbornene-2,3-dimethanol, cis-2-nonene-1-ol, cis-3-nonene-1-ol, and cis-3-octene-1-ol.
Dependencies are inferred from the claim text.