Single-side polishing apparatus, single-side polishing method, and polishing pad

A single-side polishing apparatus comprising:

• a base turntable having an upper surface with a groove for vacuum suction;
• a detachable polishing turntable immobilized on the upper surface of the base turntable by vacuum suction;
• a polishing pad attached to the polishing turntable;
• and
• a polishing head configured to hold a wafer, wherein the single-side polishing apparatus is configured to bring a surface of the wafer held by the polishing head into sliding contact with the polishing pad to polish the surface,
• the polishing pad comprises a polishing layer configured to polish the surface of the wafer, a first adhesive layer, a PET sheet layer, a second adhesive layer, an elastic layer, and a third adhesive layer for attachment to the polishing turntable, and the layers are sequentially stacked, and
• the polishing pad has a compressibility value, measured according to standard JIS L-1096, of 16% or more.