Leadless biostimulator having overmolded header assembly

A leadless biostimulator, comprising:

• a housing having a longitudinal axis and an electronics compartment;
• an electronics assembly mounted in the electronics compartment;
• and
• a header assembly mounted on the housing, wherein the header assembly includes
• a fixation element mount, wherein the fixation element mount includes a cylindrical outer mount surface and a central hole aligned with the longitudinal axis,
• a fixation element having an inner diameter extending along and partly embedded within the cylindrical outer mount surface of the fixation element mount such that a cross-sectional profile of the fixation element taken along a radial plane containing the longitudinal axis has a radially inward profile surface in conforming contact with the fixation element mount radially inward of the cylindrical outer mount surface and has a radially outward profile surface exposed radially outward of the cylindrical outer mount surface, and
• an electrode exposed to a surrounding environment through the central hole.

A method, comprising:

• overmolding a fixation element mount on a fixation element such that an inner diameter of the fixation element extends along and is partly embedded within a cylindrical outer mount surface of the fixation element mount such that a cross-sectional profile of the fixation element taken along a radial plane containing the longitudinal axis has a radially inward profile surface in conforming contact with the fixation element mount radially inward of the cylindrical outer mount surface and has a radially outward profile surface exposed radially outward of the cylindrical outer mount surface, and wherein the fixation element mount includes a central hole aligned with a longitudinal axis;
• mounting an electrode within a flange;
• and
• mounting the fixation element mount on the flange such that the electrode is exposed to a surrounding environment through the central hole.