Array substrate and preparation method therefor, and display apparatus

A method for manufacturing an array substrate, comprising:

• providing a base substrate;
• forming a driving circuit layer at a side of the base substrate;
• and
• forming a functional device layer at a side of the driving circuit layer away from the base substrate,
• wherein forming the driving circuit layer at the side of the base substrate comprises:
• forming at least one first lead layer at the side of the base substrate,
• forming any one of the first lead layer comprises:
• forming a conductive seed layer at the side of the base substrate;
• forming a removable pattern-defining layer on a surface of the conductive seed layer away from the base substrate, the removable pattern-defining layer being provided with a lead opening, and the lead opening exposing a part of the conductive seed layer;
• forming, in the lead opening, a metal plating layer on the surface of the conductive seed layer by using an electroplating process or a chemical plating process;
• removing the removable pattern-defining layer;
• and
• removing, by using an etching process, a part of the conductive seed layer not covered by the metal plating layer,
• wherein during the etching process, a surface of the metal plating layer away from the base substrate is etched partially, so that a thickness of an etched part of the metal plating layer is equal to a thickness of the conductive seed layer.