Voltage regulator module having a power stage

A voltage regulator module, comprising:

• a substrate having a power input terminal and a power output terminal;
• a power stage package mounted to the substrate and having a first pad and a second pad at a side that faces away from the substrate, the power stage package configured to receive an input voltage from the power input terminal and output a phase current at the first pad;
• a discrete inductor electrically connecting the first pad of the power stage package to the power output terminal of the substrate;
• and
• a metallic body in thermal contact with the second pad of the power stage package,
• wherein the second pad of the power stage package does not carry any of the phase current.

A method of producing a voltage regulator module, the method comprising:

• mounting a power stage package to a substrate, the substrate having a power input terminal and a power output terminal, the power stage package having a first pad and a second pad at a side that faces away from the substrate, the power stage package configured to receive an input voltage from the power input terminal and output a phase current at the first pad;
• attaching a first end of a vertical conductor of an inductor to the first pad of the power stage package, the vertical conductor being embedded in a magnetic core and having a second end opposite the first end;
• and
• attaching a metallic clip to each of the second end of the vertical conductor, the power output terminal of the substrate, and the second pad of the power stage package,
• wherein the second pad of the power stage package does not carry any of the phase current.

A method of producing a voltage regulator module, the method comprising:

• mounting a power stage package to a substrate, the substrate having a power input terminal and a power output terminal, the power stage package having a first pad and a second pad at a side that faces away from the substrate, the power stage package configured to receive an input voltage from the power input terminal and output a phase current at the first pad;
• electrically connecting the first pad of the power stage package to the power output terminal of the substrate via a discrete inductor;
• and
• thermally contacting the second pad of the power stage package with a metallic body,
• wherein the second pad of the power stage package does not carry any of the phase current.