Back to results
US 12,575,021 B2Granted
Enhanced microstrip trace
AssigneeDell Products L.P.
InventorsSandor Farkas, Bhyrav Mutnury
Life of this patent
Estimating the term…
Abstract
A printed circuit board comprising a primary dielectric layer disposed underneath a microstrip trace and a secondary dielectric layer disposed above portions of the primary dielectric layer and the microstrip trace. The printed circuit board also includes a conductive plane disposed above the secondary dielectric layer and the microstrip trace, wherein the conductive plane is grounded.
Claims20
A printed circuit board comprising:
- a primary dielectric layer disposed underneath a microstrip trace;
- a secondary dielectric layer disposed above portions of the primary dielectric layer and the microstrip trace;
- and
- a conductive plane disposed above the secondary dielectric layer and the microstrip trace, wherein the conductive plane is grounded, wherein the conductive plane is comprised of a conductive silk screen.
1 more element
An information handling system, comprising:
- a processor;
- and
- a printed circuit board further comprising:
- a primary dielectric layer disposed underneath a microstrip trace;
- a secondary dielectric layer disposed above the primary dielectric layer and the microstrip trace;
- and
- a conductive plane disposed above the secondary dielectric layer and the microstrip trace, wherein the conductive plane is grounded, wherein the conductive plane is comprised of a conductive silk screen.
4 more elements
A method comprising:
- providing a primary dielectric layer disposed underneath a microstrip trace;
- providing a secondary dielectric layer disposed above portions of the primary dielectric layer and the microstrip trace;
- and
- providing a conductive plane disposed above the secondary dielectric layer and the microstrip trace, wherein the conductive plane is grounded, wherein the conductive plane is comprised of a conductive silk screen.
1 more element
Dependencies are inferred from the claim text.