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US 12,574,013 B2Granted
Composite filter device
AssigneeMurata Manufacturing Co., Ltd.
InventorsMichiaki Saito, Junpei Yasuda
Life of this patent
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Abstract
A composite filter device includes first and second filter chips mounted on an upper surface of a substrate by first and second conductive bonds. The first filter chip includes a longitudinally coupled resonator filter. The second filter chip does not include a longitudinally coupled resonator filter. A height of the first conductive bond is lower than a height of the second conductive bond.
Claims20
A composite filter device comprising:
- a substrate including a first principal surface;
- a first filter chip including a first conductive bond and mounted on the first principal surface of the substrate by the first conductive bond;
- and
- a second filter chip including a second conductive bond and mounted on the first principal surface of the substrate by the second conductive bond;
- wherein
- the first filter chip includes a longitudinally coupled resonator filter;
- the second filter chip does not include a longitudinally coupled resonator filter;
- and
- a height of the first conductive bond is lower than a height of the second conductive bond.
6 more elements
Dependencies are inferred from the claim text.