Outer packaging for electrical storage devices, method for manufacturing said outer packaging, and electrical storage device
AssigneeDai Nippon Printing Co., Ltd.
InventorJun Kageyama
Life of this patent
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Abstract
An outer packaging for electrical storage devices is composed of a laminate provided with at least a substrate layer, a barrier layer, an adhesive layer, and a thermally adhesive resin layer in this order, wherein the peak melting temperature for the thermally adhesive resin layer is observed at 130° C. or lower, the peak melting temperature for the adhesive layer is observed at 135° C. or higher, the resin constituting the thermally adhesive resin layer has a polyolefin skeleton, and the resin constituting the adhesive layer has a polyolefin skeleton.
Claims13
An exterior material for an electrical storage device, the exterior material including a laminate provided with at least a base material layer, a barrier layer, an adhesive layer, and a heat-sealable resin layer in this order, wherein
- the heat-sealable resin layer has a melting peak temperature observed at 130° C. or lower,
- the adhesive layer has a melting peak temperature observed at 135° C. or higher,
- a resin constituting the heat-sealable resin layer has a polyolefin backbone,
- a resin constituting the adhesive layer has a polyolefin backbone, and
- a Martens hardness is 25.0 MPa or more, the Martens hardness being measured by pressing a Vickers indenter to a depth of 1 μm from a surface on a side of the heat-sealable resin layer of the exterior material for an electrical storage device in a thickness direction at a measurement temperature of 25° C. based on an indentation method.
An exterior material for an electrical storage device, the exterior material including a laminate provided with at least a base material layer, a barrier layer, an adhesive layer, and a heat-sealable resin layer in this order, wherein
- a Martens hardness is 30.0 MPa or more, the Martens hardness being measured by pressing a Vickers indenter to a depth of 1 μm from a surface on a side of the heat-sealable resin layer of the exterior material for an electrical storage device in a thickness direction at a measurement temperature of 25° C. based on an indentation method.
A method of manufacturing an exterior material for an electrical storage device, the method comprising
- a step of laminating at least a base material layer, a barrier layer, an adhesive layer, and a heat-sealable resin layer in this order to obtain a laminate, wherein
- the heat-sealable resin layer has a melting peak temperature observed at 130° C. or lower,
- the adhesive layer has a melting peak temperature observed at 135° C. or higher,
- a resin constituting the heat-sealable resin layer has a polyolefin backbone,
- a resin constituting the adhesive layer has a polyolefin backbone, and
- a Martens hardness is 25.0 MPa or more, the Martens hardness being measured by pressing a Vickers indenter to a depth of 1 μm from a surface on a side of the heat-sealable resin layer of the exterior material for an electrical storage device in a thickness direction at a measurement temperature of 25° C. based on an indentation method.
A method of manufacturing an exterior material for an electrical storage device, the method comprising
- a step of laminating at least a base material layer, a barrier layer, an adhesive layer, and a heat-sealable resin layer in this order to obtain a laminate, wherein
- a Martens hardness is 30.0 MPa or more, the Martens hardness being measured by pressing a Vickers indenter to a depth of 1 μm from a surface on a side of the heat-sealable resin layer of the exterior material for an electrical storage device in a thickness direction at a measurement temperature of 25° C. based on an indentation method.
Dependencies are inferred from the claim text.