Mass transfer method for micro light-emitting diodes, and display panel

A display panel, comprising:

• a target substrate comprising:
• display regions;
• and
• a frame sealant surrounding the display regions;
• an intermediate carrying adhesive layer covering the display regions, an orthographic projection, on the target substrate, of the intermediate carrying adhesive layer being positioned in an orthographic projection, on the target substrate, of the frame sealant;
• a thermoplastic resin layer covering the intermediate carrying adhesive layer, an orthographic projection, on the target substrate, of the thermoplastic resin layer being positioned in an orthographic projection, on the target substrate, of the frame sealant;
• and
• a protective structure covering the thermoplastic resin layer and the frame sealant;
• wherein the display regions are provided with a plurality of sub-pixels and post spacers arranged in gaps between the sub-pixels;
• and
• each sub-pixel comprising a micro light emitting diode.

A mass transfer method for micro light emitting diodes, comprising:

• picking up the micro light emitting diodes on an element substrate through a transfer substrate and transferring the micro light emitting diodes after pickup to an intermediate carrying substrate;
• and
• transferring micro light emitting diodes, corresponding to all sub-pixels on a target substrate, on the intermediate carrying substrate into the sub-pixels of the target substrate at one time, so that all the sub-pixels on the target substrate receive micro light emitting diodes at one time;
• wherein said transferring micro light emitting diodes, corresponding to all sub-pixels on a target substrate, on the intermediate carrying substrate into the sub-pixels of the target substrate at one time, so that all the sub-pixels on the target substrate receive micro light emitting diodes at one time comprises:
• box-aligning the intermediate carrying substrate with the target substrate under a first set pressure;
• press-fitting the intermediate carrying substrate and the target substrate under a second set pressure;
• and
• electrically connecting the micro light emitting diodes, corresponding to all sub-pixels on a target substrate, on the intermediate carrying substrate to electrodes in the corresponding sub-pixels on the target substrate at one time, so that all the sub-pixels on the target substrate receive micro light emitting diodes at one time, one micro light emitting diode on the intermediate carrying substrate corresponding to one sub-pixel on the target substrate, and the second set pressure being greater than the first set pressure.