Force, deflection, resistance, and temperature testing system and method of use

A method of testing an electrical interconnect, the steps comprising:

• providing an electrical interconnect testing device;
• providing an electrical interconnect;
• the electrical interconnect having a plurality of contact points;
• attaching the electrical interconnect to the electrical interconnect testing device;
• providing a device under test;
• aligning the device under test with the electrical interconnect;
• providing an environmental chamber;
• pressing the device under test into the electrical interconnect with a plurality of different levels of force while the environmental chamber is at a first temperature;
• and
• taking at least one measurement of at least one electrical property while the device under test is pressed with the plurality of different levels of force and the environmental chamber is set to the first temperature;
• pressing the device under test into the electrical interconnect with the plurality of different levels of force while the environmental chamber is at a second temperature;
• and
• taking at least one measurement of at least one electrical property while the device under test is pressed with the plurality of different levels of force and the environmental chamber is set to the second temperature.

A method of testing an electrical interconnect, the steps comprising:

• providing an electrical interconnect testing device;
• providing an electrical interconnect;
• the electrical interconnect having a plurality of contact points;
• attaching the electrical interconnect to the electrical interconnect testing device;
• providing a device under test;
• aligning the device under test with the electrical interconnect;
• providing an environmental chamber;
• pressing the device under test into the electrical interconnect to a plurality of different positions while the environmental chamber is at a first temperature;
• and
• taking at least one measurement of at least one electrical property while the device under test is pressed to the plurality of different positions and the environmental chamber is set to the first temperature.

A method of testing an electrical interconnect, the steps comprising:

• providing an electrical interconnect testing device;
• providing an electrical interconnect;
• the electrical interconnect having a plurality of contact points;
• attaching the electrical interconnect to the electrical interconnect testing device;
• providing a device under test;
• aligning the device under test with the electrical interconnect;
• providing an environmental chamber;
• pressing the device under test into the electrical interconnect to a plurality of different positions while the environmental chamber is at a first temperature;
• taking at least one measurement of at least one electrical property while the device under test is pressed to the plurality of different positions and the environmental chamber is set to the first temperature;
• pressing the device under test into the electrical interconnect to a plurality of different positions while the environmental chamber is at a second temperature;
• taking at least one measurement of at least one electrical property while the device under test is pressed to the plurality of different positions and the environmental chamber is set to the second temperature.

A method of testing an electrical interconnect, the steps comprising:

• providing an electrical interconnect testing device;
• providing an electrical interconnect;
• attaching the electrical interconnect to the electrical interconnect testing device;
• providing a device under test;
• providing an environmental chamber;
• providing a testing recipe;
• adjusting the environmental chamber to a first temperature according to the testing recipe;
• pressing the device under test into the electrical interconnect testing device according to the testing recipe while the environmental chamber is at the first temperature;
• taking at least one measurement of at least one electrical property while the device under test is pressed into the electrical interconnect according to the testing recipe and the environmental chamber is at the first temperature.