Heat dissipation module and anti-condensation method of projection device

An anti-condensation method applicable to a heat dissipation module of a projection device, wherein the heat dissipation module of the projection device comprises a heat generating component, a thermoelectric cooling chip, a heat insulating hollow body, a heating element and a control component, a cold end of the thermoelectric cooling chip is connected to the heat generating component by means of heat conduction, the heat insulating hollow body has a first opening and a second opening that communicate with each other, the thermoelectric cooling chip is disposed in the first opening and seals the first opening, the cold end is located in the heat insulating hollow body, the heat generating component is disposed in the second opening and seals the second opening, the heating element is configured to heat the heat insulating hollow body, the control component is electrically connected to the heating element, and the anti-condensation method comprises steps of:

• determining whether a temperature in the projection device is lower than or equal to a dew point temperature by the control component;
• and
• driving the heating element to heat the heat insulating hollow body by the control component in response to the temperature in the projection device being lower than or equal to the dew point temperature.