High thermal conductive silicone composition

A high thermal conductive silicone composition, comprising:

• (A) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups in one molecule and a kinematic viscosity at 25° C. of 100 to 100,000 mm2/s;
• (B) an aluminum powder having an average particle size of 50 μm or more;
• (C) a thermal conductive filler having an average particle size of 0.1 to less than 50 μm;
• (D) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to a silicon atom (Si—H groups) in one molecule, with [the number of Si—H groups in the component (D)]/[the number of alkenyl groups in the component (A)] of 0.5 to 1.5;
• (E) a hydrolyzable organopolysiloxane represented by the following general formula (1) in an amount of 0.1 to 10% by mass relative to a total amount of the composition,
• wherein R1's each represent a monovalent hydrocarbon group having 1 to 10 carbon atoms optionally having a substituent, and are identical to or different from one another, and “m” represents an integer of 5 to 100;
• and
• (F) a platinum group metal catalyst having an effective amount;
• wherein a sum of the component (B) and the component (C) accounts for 90 to 95% by mass relative to a total amount of the composition, and a thermal conductivity of the high thermal conductive silicone composition at 25° C. determined by a hot disc method in accordance with ISO 22007-2 is 7 W/m·K or more, and an absolute viscosity at 25° C. is 50 to 1,000 Pa·s.